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 PEMD19; PUMD19
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = open
Rev. 01 -- 17 February 2005 Product data sheet
1. Product profile
1.1 General description
NPN/PNP resistor-equipped transistors.
Table 1: Product overview Package Philips PEMD19 PUMD19 SOT666 SOT363 JEITA SC-88 PNP/PNP complement PEMB19 PUMB19 NPN/NPN complement PEMH19 PUMH19
Type number
1.2 Features
s s s s Built-in bias resistors Simplifies circuit design Reduces component count Reduces pick and place cost
1.3 Applications
s Low current peripheral driver s Control of IC inputs s Replacement of general-purpose transistors in digital applications
1.4 Quick reference data
Table 2: Symbol VCEO IO R1 Quick reference data Parameter collector-emitter voltage output current (DC) bias resistor 1 (input) Conditions open base Min 15.4 Typ 22 Max 50 100 28.6 Unit V mA k
Philips Semiconductors
PEMD19; PUMD19
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = open
2. Pinning information
Table 3: Pin 1 2 3 4 5 6 Pinning Description GND (emitter) TR1 input (base) TR1 output (collector) TR2 GND (emitter) TR2 input (base) TR2 output (collector) TR1
TR1
Simplified outline
6 5 4
Symbol
6 5 4
R1 TR2
1
2
3
001aab555
R1
1
2
3
006aaa269
3. Ordering information
Table 4: Ordering information Package Name PEMD19 PUMD19 SC-88 Description plastic surface mounted package; 6 leads plastic surface mounted package; 6 leads Version SOT666 SOT363 Type number
4. Marking
Table 5: PEMD19 PUMD19
[1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China
Marking codes Marking code [1] 6E T4*
Type number
9397 750 14408
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2005
2 of 11
Philips Semiconductors
PEMD19; PUMD19
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = open
5. Limiting values
Table 6: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IO ICM Ptot Parameter collector-base voltage collector-emitter voltage emitter-base voltage output current (DC) peak collector current total power dissipation SOT363 SOT666 Tstg Tj Tamb Per device Ptot total power dissipation SOT363 SOT666
[1] [2]
Conditions open emitter open base open collector
Min -
Max 50 50 5 100 100 200 200 +150 150 +150
Unit V V V mA mA mW mW C C C
Per transistor; for the PNP transistor with negative polarity
Tamb 25 C
[1] [1] [2]
-65 -65
storage temperature junction temperature ambient temperature Tamb 25 C
[1] [1] [2]
-
300 300
mW mW
Device mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. Reflow soldering is the only recommended soldering method.
6. Thermal characteristics
Table 7: Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient SOT363 SOT666 Per device Rth(j-a) thermal resistance from junction to ambient SOT363 SOT666
[1] [2]
Conditions Tamb 25 C
[1] [1] [2]
Min
Typ
Max
Unit
Per transistor
-
-
625 625
K/W K/W
Tamb 25 C
[1] [1] [2]
-
-
416 416
K/W K/W
Device mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. Reflow soldering is the only recommended soldering method.
9397 750 14408
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2005
3 of 11
Philips Semiconductors
PEMD19; PUMD19
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = open
7. Characteristics
Table 8: Characteristics Tamb = 25 C unless otherwise specified. Symbol ICBO ICEO Parameter collector-base cut-off current collector-emitter cut-off current emitter-base cut-off current DC current gain collector-emitter saturation voltage bias resistor 1 (input) collector capacitance TR1 (NPN) TR2 (PNP) VCB = -10 V; IE = ie = 0 A; f = 1 MHz 2.5 3 pF pF Conditions VCB = 50 V; IE = 0 A VCE = 30 V; IB = 0 A VCE = 30 V; IB = 0 A; Tj = 150 C VEB = 5 V; IC = 0 A VCE = 5 V; IC = 1 mA IC = 10 mA; IB = 0.5 mA Min 100 15.4 Typ 22 Max 100 1 50 100 150 28.6 mV k Unit nA A A nA Per transistor; for the PNP transistor with negative polarity
IEBO hFE VCEsat R1 Cc
9397 750 14408
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2005
4 of 11
Philips Semiconductors
PEMD19; PUMD19
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = open
500 hFE
(1)
006aaa172
103
006aaa173
400
VCEsat (mV)
(2)
300
102
(2) (1)
(3)
200
(3)
100 10-1
1
10 I C (mA)
102
10 1 10 I C (mA)
102
VCE = 5 V (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -40 C
IC/IB = 20 (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -40 C
Fig 1. TR1 (NPN): DC current gain as a function of collector current; typical values
103
006aaa196
Fig 2. TR1 (NPN): Collector-emitter saturation voltage as a function of collector current; typical values
-1
006aaa197
(1)
hFE
(2) (3)
VCEsat (V)
102
-10-1
(1) (2) (3)
10 -10-1
-1
-10 IC (mA)
-102
-10-2 -10-1
-1
-10 IC (mA)
-102
VCE = -5 V (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -40 C
IC/IB = 20 (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -40 C
Fig 3. TR2 (PNP): DC current gain as a function of collector current; typical values
Fig 4. TR2 (PNP): Collector-emitter saturation voltage as a function of collector current; typical values
9397 750 14408
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2005
5 of 11
Philips Semiconductors
PEMD19; PUMD19
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = open
8. Package outline
Plastic surface mounted package; 6 leads SOT363
D
B
E
A
X
y
HE
vMA
6
5
4
Q
pin 1 index
A
A1
1
e1 e
2
bp
3
wM B detail X Lp
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1
OUTLINE VERSION SOT363
REFERENCES IEC JEDEC JEITA SC-88
EUROPEAN PROJECTION
ISSUE DATE 97-02-28 04-11-08
Fig 5. Package outline SOT363 (SC-88)
9397 750 14408 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2005
6 of 11
Philips Semiconductors
PEMD19; PUMD19
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = open
Plastic surface mounted package; 6 leads
SOT666
D
A
E
X
S
YS HE
6
5
4
pin 1 index A
1
e1 e
2
bp
3
wMA Lp detail X
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 0.6 0.5 bp 0.27 0.17 c 0.18 0.08 D 1.7 1.5 E 1.3 1.1 e 1.0 e1 0.5 HE 1.7 1.5 Lp 0.3 0.1 w 0.1 y 0.1
OUTLINE VERSION SOT666
REFERENCES IEC JEDEC JEITA
EUROPEAN PROJECTION
ISSUE DATE 01-08-27 04-11-08
Fig 6. Package outline SOT666
9397 750 14408 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2005
7 of 11
Philips Semiconductors
PEMD19; PUMD19
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = open
9. Packing information
Table 9: Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. Type number PEMD19 PUMD19 PUMD19
[1] [2] [3]
[1]
Package SOT666 SOT363 SOT363
Description 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel; T1 4 mm pitch, 8 mm tape and reel; T2
[2] [3]
Packing quantity 3000 -115 -125 4000 -115 10000 -135 -165
For further information and the availability of packing methods, see Section 14. T1: normal taping T2: reverse taping
9397 750 14408
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2005
8 of 11
Philips Semiconductors
PEMD19; PUMD19
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = open
10. Revision history
Table 10: Revision history Release date Data sheet status Product data sheet Change notice Doc. number 9397 750 14408 Supersedes Document ID
PEMD19_PUMD19_1 20050217
9397 750 14408
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2005
9 of 11
Philips Semiconductors
PEMD19; PUMD19
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = open
11. Data sheet status
Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
12. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
13. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
14. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
9397 750 14408
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 17 February 2005
10 of 11
Philips Semiconductors
PEMD19; PUMD19
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = open
15. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information. . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information . . . . . . . . . . . . . . . . . . . . 10
(c) Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 17 February 2005 Document number: 9397 750 14408
Published in The Netherlands


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